Welding removal technique of SMT patch processing

///Welding removal technique of SMT patch processing
1200mm-aluminum-double-sided-LED-circui-board-from-China-pcb-manufacturer

What are the techniques for the dismantling of SMT patches?Generally speaking, it is not so easy to remove the SMT patch processing elements. Need practice frequently to master, otherwise, SMD components will easily be destroyed if forcibly removed. Here have three welding removal techniques of SMT patch processing.

Kingford-PCBA-PCB-assembly-SMT-DIP

Kingford-PCBA-PCB-assembly-SMT-DIP

1. For SMD components with less foot, such as resistor, capacitance, second, Triode, etc. First, tin is plated on one of the pcb pads. Then the left hand holds the element with tweezers and holds it against the circuit board. The right hand solders the pins on the tinned pads with a soldering iron. The left hand tweezers can be loosened and the rest of the feet are welded with tin wire instead. It is also easy to remove such elements by heating both ends of the element simultaneously with a soldering iron and removing the element after the tin is melted lightly.

2. For components with more pins for SMT patch machining elements, it also use similar method for more spaced patch elements. First tin on a pad, then the left hand with tweezers to hold the element to weld one foot, and then solder the rest of the foot with tin wire. This kind of component is usually removed with hot air gun, holding hot air gun in one hand to blow solder melt, the other hand using tweezers and other jigs to remove the element while the solder is melting.

3. For components with high pin density, the welding procedure is similar, that is, one foot is welded first, then the rest of the foot is soldered with tin wire. The number of pins is relatively large and dense, and the alignment of the pin pads is critical. The pads that are usually selected at the corners are plated with only a small amount of tin and the components are aligned with the pads with tweezers or hands. All the edges of the pins are aligned. Press the component slightly on the PCB board. Solder the solder pins corresponding to the solder pads.
Suggestion: The removal of the high pin density components is mainly performed with a hot air gun. Hold the components with tweezers and blow all the pins back and forth with a hot air gun, then lift the components when they are all melted. Remove the components and clean the pad with a soldering iron.

All of these are the techniques for the dismantling of SMT patches.

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2018-08-07T04:08:16+00:00