Ceramic substrate refers to the copper foil at high temperature directly bonded to the alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate surface (single-sided or double-sided) on the special Process board. Made of ultra-thin composite substrate with excellent electrical insulation properties, high thermal conductivity, excellent soft soldering and high adhesion strength, and can be like the PCB board can etch a variety of graphics, with a large load current capacity. Therefore, the ceramic substrate has become the basic material of high power electronic circuit structure technology and interconnect technology.
High-power power semiconductor module, semiconductor cooler, electronic heater, power control circuit, power mixing circuit.
Intelligent Power Module, high frequency switching power supply, solid-state relay.
Automotive electronics, aerospace and military electronic components.
Solar panel assembly, Telecommunication special switch, receiving system, laser and other industrial electronics.
Strong mechanical stress, stable shape, high strength, conductivity rate, good insulation, strong adhesion, anti-corrosion.
Excellent thermal cycling performance, the number of cycles up to 50,000 times, high reliability.
As with the PCB (or IMS substrate) can be etched with a variety of graphics structure, non-polluting, pollution-free.
The production process of the Power module is simplified by using the temperature width -55℃~850℃ and the thermal expansion coefficient close to the silicon.
Name: Anna Huang(Ms.)
Address:Floor 10,Chuangye Building ,8-28 Centre Road,Shajing,Bao’an District,Shenzhen,China