Failure analysis is an important part in the reliability of SMT electronic assembly process. It is necessary to have certain testing and analysis equipment to carry out the failure analysis of electronic process.
PCBA processing wave welding notes :PCBA after wave welding, cleaning board, storage and maintenance may be white around the pad. The white stuff is mostly residue
SMT factory layout and location requirements: 1, fire extinguisher placement area, 2, material rack car placement area, 3, material preparation table placement area, 4, printing station table placement area, 5, tin paste placement area, 6, after the furna
In PCB production, the circuit board also needs to be tested to see whether the circuit is open, short circuit phenomenon. This works as a needle bed, testing against each network point
Spacing is more important in high voltage designs because the voltage across the board components makes arcing between the two conducting components more likely to occur on your PCB. Any electric arcs that do occur pose a higher risk to both the product a
PCBA contracted work and materials matters needing attention :1. Circuit design; 2. Selection of materials; 3. Selection of PCBA factory
The effect of horizontal perforation electroplating in machining multilayer circuit boards is far inferior to that of vertical perforation electroplating.
SMT SMT processing technology has the advantages of: first, high reliability, strong vibration resistance, second, small size of electronic products, high assembly density, third, high frequency characteristics, reliable performance, four, improve product
With the high density interconnection design of PCB board and the progress of electronic technology, carbon dioxide laser processing equipment has become an important tool for PCB board manufacturers to process microholes.
The drawing maintenance method refers to the schematic diagram, analyzes the circuit principle and signal direction, and then tests the signals on the key points. Professional maintenance companies maintain circuit boards almost without drawing.
The final electrical conductivity, impedance test and solder and thermal shock tolerance test are carried out on PCB before packaging. And bake to eliminate the moisture and thermal stress absorbed by PCB in the process, and finally packaging and shipping
The high-speed digital signal is determined by the edge speed of the signal. It is generally believed that the rise time is less than 4 times the signal transmission delay can be regarded as high-speed signal.
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