When wiring the printed board, the position of the components on the board should be determined first, and then the ground wire and power cord should be distributed. When arranging high speed signal lines, it is best to consider low speed signal lines.
When the overshoot is serious, the protection diode will fail prematurely because of its work. Severe downstrokes can cause false clock or data errors (misoperation)
According to customers' individual needs, we can exchange the positions of components in the board, rearrange the circuit and pcb design layout, etc., in order to achieve the desired effect of customers.
The PCBA project should be completed in seven steps: first, preliminary preparation stage, second, design and development, third, design and editing of operation instruction of SMT production process, fourth, confirmation of steel mesh production ability,
Generally, there are several ways to deal with analog ground and digital ground: 1, directly separate,2, digital ground and analog ground connected with magnetic beads; 3, digital and analog ground with capacitor connection, using the principle of capacit
The reasons for virtual welding in SMT patch processing are: (1) Virtual welding caused by SMT process factors; (2) Virtual welding caused by PCB factors; (3) Virtual welding caused by component factors; (4) Virtual welding caused by SMT equipment factors
Factors leading to uneven processing of FPC patch: 1. FPC deformation; 2. 2. Thickness and position of attached materials; 3. FPC strengthen the thickness of the plate or the back glue
The main measures to reduce the surface tension and viscosity in PCBA welding process are as follows: (1) increase the temperature, (2) adjust the proportion of metal alloy, (3) increase the active agent, and (4) improve the PCBA welding process environme
In case of tinning, corresponding measures should be taken: 1. Adjust welding process parameters: 2. Replacement of solder alloy: 3. Replacement of components: 4. Check the surface treatment of PCB board and components: 5. Inspection equipment
There may be seven reasons for unrounded solder joints in SMT processing: 1. Slag and bubbles: 2. Improper temperature control: 3. Insufficient welding time; 4. Insufficient soldering tin; 5. Uneven PCB surface: 6. The solder particle is too large: 7. The
The following are four ways to ensure the quality of PCBA processing: 1. Quality control, 2. Inspection and testing, 3. Use high quality raw materials: 4. Professional technical team
PCB board bending or warping is usually caused by: 1. Temperature change: 2. Uneven plating: 3. Uneven PCB board thickness: 4. Improper plate size 5. Uneven welding: 7. Improper PCB board processing: 8. Material problems of PCB board 9. Design problems of
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