How to protect multilayer PCB edge radiation by PCB design?
Protection measures of multilayer PCB edge radiation: The three elements of EMC problems are: electromagnetic interference source, coupling path, sensitive equipment
Protection measures of multilayer PCB edge radiation: The three elements of EMC problems are: electromagnetic interference source, coupling path, sensitive equipment
When designing the PCB, please note the following points: The shape of a and Mark point is symmetrical up and down or symmetrical left and right, and the size of b and A is 2.0mm. c, from the outer edge of Mark point 2.0mm, there should be no shape and co
Solutions to printing faults in SMT patch processing: 1. There is no gap between the mold and PCB printing mode, which is called "touch printing". Second, the installation should choose the IC installation height of no more than 0.5mm, 0mm or 0~...
The reasons for white spots in PCBA processing are as follows: 1. The circuit board is under inappropriate thermal stress; 2. 2. Due to the influence of mechanical force, part of the resin is separated from the glass fiber, forming white spots; 3. Some PC
There are five methods to solve the welding porosity of the patch: 1, baking, 2, tin paste, 3, humidity, 4, furnace temperature curve, 5, flux
SMT SMT processing discarding solutions: 1. Clean and replace the nozzle, 2. Clean and wipe the surface of the identification system, keep it clean, free of debris, 3. Adjust the suction position, 4. Sharply adjust the air pressure to the required pressur
Solder paste printing principle: solder paste contact solder paste through the steel plate hole, printed on the substrate tin pad (PCB plate solder plate).
Follow reasonable testing methods to avoid various defects and hidden dangers: I. Incoming SMT material testing; II. SMT processing testing
Four suggestions for PCB design: 1, about positioning hole, 2, about MARK point, 3, about 5mm edge, 4, do not directly on the pad over the hole,
With the popularity of SMT lead-free process technology, the demand for PCB substrate is getting higher and higher. The performance of PCB can be improved from the design of PCB.
Why do you want to talk about the schematic principle in detail, because the schematic diagram contains a lot of information to draw PCB, such as the access point of the element pin, the current size of the node network, etc., see clearly the schematic di
Any non-standard operation in any link will seriously affect the quality of PCBA patch. The quality of PCBA patch can be controlled through the key links of steel mesh making, solder paste control, furnace temperature curve setting and AOI detection.