The cleaning process needs to consume energy, manpower and cleaning materials, especially the waste gas, waste water discharge and environmental pollution caused by cleaning materials, which has become a problem that must be paid attention to.
Mixing process is in the PCB board A side has a number of IC components, and inserted with through hole components, on the other side of the PCB (B side) and there are many patch resistance capacitance electrical parts, sometimes IC, often called "mi...
Flexible printed circuit board is composed of flexible substrate (PI/PET), copper foil and binder. It is widely used in consumer electronic terminal products, such as smart phones, tablets, personal medical devices and so on.
The influence of human factors on manual welding of soldering iron is more. Machine welding, once the process parameters are adjusted, the production is very stable, but there are problems of welding temperature and welding time in manual welding.
Optimization design skills of circuit board heat dissipation :1. Heat dissipation by PCB board itself,2. High heating device with radiator, heat conduction plate,3. For the use of free convection air cooling equipment, the integrated circuit is arranged i
SMT patch processing main characteristics: 1, high density: 2, small aperture: 3, low coefficient of thermal expansion: 4, high temperature resistance performance:
Manual welding methods for SMT patch processing of leadless chip components: one by one welding spot, two, using special tools horseshoe iron head welding, three, using flat chip iron head quick welding
The reasons for the need for post-welding processing are as follows: 1, the components are not resistant to high temperature, 2, the components are too high, 3, there are a small number of plug-ins in the side of the wave crest, 4, the components plug-in
SMT SMT technology: The main content of surface assembly technology can be divided into four parts: assembly material selection, assembly process design, assembly technology and assembly equipment application.
Application scope: SMT, LED, BGA, CSP flip chip testing, semiconductor, packaging components, lithium industry, electronic components, automotive parts, photovoltaic industry, aluminum die casting, molded plastics, ceramic products and other special indus
Common PCB welding pad over wave soldering defects have the following points: (1) board surface dirty. (2) PCB deformation. (3) drop (drop) the piece. (4) Other recessive defects.
In the dispensing process, the technical parameters of the patch glue and the dispensing machine can be changed as follows: (1) the rheology of the patch glue. (2) The initial adhesive strength of the patch adhesive. (3) glue point contour. (4) glue point
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