How to improve PCB wiring level: 1, common ground processing of digital circuit and analog circuit, 2, signal wiring on the electrical (ground) layer, 3, connection leg processing in large area conductor, 4, role of network system in wiring, 5, power supp
Brief description of SMT patch processing and manufacturing preparation: 1. Engineering, II. Production SMT patch processing: III. Quality, four. Current process: five. New process (optimization)
SMT basic process elements: solder paste printing -> Parts mounting --> Reflow welding --> AOI Optical Detection --> Maintenance --> The board is divided.
Scan the circuit board, record the location of the components in detail, disassemble the components to make a bill of materials and arrange material purchase, and scan the empty board into pictures to process and restore the PCB board drawing file.
What are the specifications of Mark processing steps: 1. The processing method of Mark, whether Mark is needed, which side of the template, etc. 2. Which side of the template Mark graphics should be placed according to the specific structure of the printi
Advantages and applications of Anisotropic conductive adhesive (ACA) compared with traditional tin-lead solder: (1) It is suitable for ultra-fine spacing (50um), which is conducive to further miniaturization of packaging. (2) ACA has low curing temperatur
We should start from the design of PCBA lead-free products to consider the compatibility between lead-free materials, lead-free and design, lead-free and process compatibility; Give full consideration to heat dissipation; Carefully select PCB board, pad s
After the design of PCB board, the need to choose the circuit board surface treatment process, the circuit board surface treatment process is now commonly used HASL (surface spray tin process), ENIG (gold process), OSP (oxidation prevention process).
PCB performance test is a necessary test to ensure the stability of product performance after processing. It is divided into different tests according to the actual environment and purpose of product use.
First, scan the circuit board of the copying board, record the location of the components in detail, remove the components to make the BOM, scan the empty board into pictures, process and restore the PCB board drawing file.
The main purpose of solder paste printing technology is to solve the problem of incompatibility with solder paste printing capacity. According to professional statistics, 60% of reworked PCBS are caused by poor solder paste printing.
The demand for multifunctional, miniaturized, high-density, high-performance and high-quality electronic products is increasing. High welding quality has become the life insurance of electronic products.
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