PCB deformation causes can be divided into thermal stress and mechanical stress. The thermal stress is mainly produced in the process of pressing, and the mechanical stress is mainly produced in the process of stacking, handling and baking.
SMT patch factory control method of temperature and humidity sensitive elements: 1, environmental control, 2, process control, 3, control method
The basic process composition of SMT patch processing includes: screen printing (or dispensing), mounting (curing), reflow welding, cleaning, detection, repair screen printing
The main adverse phenomena in the solder paste printing process of SMT patch processing are as follows:After printing, the solder paste is not enough and gradually spreads to the outside of the pad. Reason analysis: 1, the scraper pressure is too large, 2
Analysis of the causes of short-circuit defects: 1, the solder paste collapse 2, the bottom surface of the steel mesh contaminated, 3, the pressure is too large to lead to the solder paste from the bottom of the steel mesh seepage surface overflow pad to
The size of electronic devices is also getting smaller, which requires that the heat dissipation device itself should have certain heat dissipation conditions, and the heat dissipation device itself should also have certain heat dissipation conditions.
In the process of PCB production, the physical and chemical properties of each material are different, and the thermal stress residual generated in the pressing process leads to the bending and warping of the board.
The base material of printed circuit board is usually glass fiber reinforced phenolic resin or epoxy resin, and various components are welded on it. The composition is very complex, including a variety of metals, which has high resource recovery value.
Waste PCB board environmental protection recycling line is not only in each production link, each process in strict requirements, even every detail carefully pondering.
Lead and bromine are the hottest topics right now. Lead-free halogen will affect the development of PCB in many ways.
With the gradual development of electronic products to fine and intelligent, more materials are applied in them. Understand the characteristics of various materials used in the product, and adopt more suitable laser processing technology and process.
For RF microwave signal transmission line, or preferred to walk the arc line, or even to walk the "45° external miter" line
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