With the wide application of wireless communication technology in various fields, high frequency, high speed and high density have gradually become one of the development trends of modern electronic products.
Communicate electronic devices. Military weapon system, as long as there is integrated circuit and other electronic devices, electrical interconnection between them to use PCB, circuit board.
In the PCB surface treatment process, we often confuse several processing processes: gold plating, gold plating and nickel palladium.
The procurement of certain PCB boards is controlled only by the specifications embedded in the Gerber packet. PCB boards can be built from these packets, regardless of mechanical tolerances.
At present, there are two kinds of metallization methods for LTCC subgrade plate: thick film sintering method and sputtering film plating thickening method.
Low temperature co-fired ceramics (LTCC) is a multi-layer ceramic manufacturing technology that integrates interconnection, componentless and encapsulation.
The high-rise plate is thicker, heavier and larger than the conventional multilayer plate. The corresponding heat capacity is also larger. When welding, more heat is needed and the welding high temperature time is longer.
In the core structure, all the conductive layers in the circuit board are coated on the core material; In the foil-coated structure, only the internal conductive layer of the circuit board is applied to the core material, and the external conductive layer
The progress and development of copper clad plate is also driven by the innovation and development of electronic machine products, semiconductor manufacturing technology, electronic installation technology and PCB manufacturing technology. In this case, c
The properties of the developed substrate materials are provided to the designer of the whole electronic products in time, so that the designer can establish accurate and advanced data basis.
The simultaneous dumping of current underground may temporarily raise the ground's electrical potential, causing a change in reference, a phenomenon known as ground rebound. The main conditions that affect grounding bounce include load capacitance, socket
With the 3D capabilities of the layout tool, designers can interactively handle their component placement in real time and correct all clearance errors in the design's mechanical features.
Telegram
