What are the difficulties in the production process of PCB multilayer circuit board?
There are many exquisite PCB presets, whether it is the principle of presets or components mix and match, are strict requirements.
There are many exquisite PCB presets, whether it is the principle of presets or components mix and match, are strict requirements.
The trend of printed boards in global shopping malls is to introduce blind buried hole circuit boards in high-density interconnected products, and then more useful space saving, so that the line width, line spacing is thinner and narrower.
For different PCB manufacturer facilities technical level may reveal different causes of bubbling phenomenon, the specific situation should be analyzed in detail, can not be mentioned together.
in the process of PCB copying board, PCB scanning is undoubtedly the first step of all processes. Therefore, we first get a good PCB board, and then it must be scanned by the computer, and then backup the relevant parameters and the original PCB layout.
PCB copying board design and manufacturing is from the subtraction method to addition method, this paper mainly describes the PCB subtraction method and addition method related concepts and manufacturing process, for your reference to learn!
PCB copy board design step two: Draw your own definition of non-standard device package libraryIt is suggested to put the devices drawn by yourself into a dedicated design file of PCB library.
Printed circuit board will appear in almost every kind of electronic equipment, is the basis of the entire electronic products.
There are many procedures to be paid attention to in SMT patch processing, especially solder paste printing. But there are a lot of issues that are important but not being noticed.
The onboard antenna needs to be placed at the edge of the board and where the antenna area is located. Copper foil exclusion zones are required for all layers, and the antenna should be separated from the ground plane of the PCB.
The dimensional stability of multilayer PCB is the main factor affecting the positioning accuracy of the inner layer. The effect of thermal expansion coefficient of substrate and copper foil on the inner layer of multilayer PCB is also considered.
The oxidation of sunken gold plate is the contamination of the gold surface by impurities. The impurities attached to the gold surface change color after oxidation, which leads to the oxidation of the gold surface.
The holes on the circuit board are divided into overcurrent holes, plug-in holes and installation holes.