it is best to check whether the power supply of the equipment is correctly supplied to the circuit board as required, and whether the interface plug-ins on the circuit board are connected.
The fabrication of microholes on the circuit board and the molding of the circuit board as the hot spot of laser processing have created a sensation in the world, laser processing with its superiority has brought huge benefits.
The layout and wiring of the meta parts is a very flexible office. The layout and wiring of the meta parts are not unique. The final result of the layout and wiring depends very much on the experience of the person who assumes the position of the PCB.
Printed circuit board develops from single layer to double panel, multilayer board and flexible board, and continuously develops to high precision, high density and high reliability direction.
Denser PCBS, higher bus speeds, and analog RF circuits pose unprecedented testing challenges that require careful design, thoughtful testing methods, and appropriate tools to provide reliable test results.
In electronic assembly, printed circuit board is a key component. It is equipped with other electronic parts and connected to the circuit to provide a stable circuit working environment.
With increasing frequency, it becomes more and more difficult to control the phase consistency of printed circuit board materials. Accurately predicting the phase change of circuit board materials is not a simple or routine task.
The SMT lead-free process should also be designed and tested in accordance with the principles of simple selection, good quality, short process route, fewer types of process materials and low cost of SMT patch processing
In the production process, it can be prevented in the following ways: 1, moisture-proof storage of components, 2, select good quality solder paste, 3, adjust printing parameters of false welding and false welding problems, 4, control the welding time, 5,
In the manufacturing process of HDI circuit board, there are many defects and difficulties in the process, among which the most important problems are the blind hole sag can not be routed, can not be transferred to form the circuit and so on.
There are two ways to make high-speed circuits work on relatively long lines without serious waveform distortion.
The two major difficulties in the field of microelectronics are the processing of high-frequency signals and weak signals. The same principle design, the same components, different people produced PCB circuit boards will have different results.
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