Analysis of PCB deformation causes :1. The uneven area of the copper plane on the circuit board will aggravate the bending and warping of the circuit board. 2. The weight of the PCB board itself may also cause the board to sag and deform.
Key parameters of reflow welding equipment :1. Number, length and width of temperature zone; 2. Symmetry of upper and lower heaters; 3. Uniformity of temperature distribution in the warm zone; 4. Independence of transmission speed control in temperature i
PCB circuit board four special plating methods: finger plating, through hole plating, coil continuous selection plating, brush plating.
Because the wider the printed line is, the smaller the inductance is, the lead line from the pad to the hole should be widened as far as possible, and the width of the pad should be the same as far as possible. In this way, even the capacitance of 0402 pa
The key factors of PCBA crimping technology are as follows: (1) crimping end; ② Printed board; ③ crimping process; (4) Crimping tools and equipment
The reasons for component displacement in patch processing are as follows: 1, the use time of solder paste is limited, 2, the solder paste itself is not sticky enough, 3, the flux content in solder paste is too high, 4, in the process of printing and patc
During the installation of the reinforced frame and the PCBA, and the installation of the PCBA and the chassis, directly or forcibly install the warped PCBA or the warped reinforced frame and install the PCBA in the deformed chassis.
Factors affecting the printing thickness of solder paste: reduce the thickness of steel mesh plate, is to reduce the amount of solder paste, solder paste melting surface tension will be reduced. When the thickness is reduced, the solder paste is thinner,
5 PCBA processing automation production of PCB size, shape, transmission edge, positioning hole, positioning symbol requirements.
The quality of reflow welding is affected by many factors, the most important factor is the temperature curve of reflow furnace and the ingredient number of solder paste in the process of electronic production
The cleaning quality detection methods of PCBA are as follows: 1. Test methods of ion pollutants: (1) extraction solution resistivity test method, (2) ion chromatography test method
Significance of PCB cleaning after surface mounting welding: 1. PCB cleaning after surface mounting welding can prevent the occurrence of electrical defects. 2. PCB cleaning after surface mounting and welding can eliminate corrosive substances. 3. The PCB
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