Core plate fabrication → inspection → surface treatment → superimposed semi-curable sheet and RCC→ pressing → positioning of the pattern of the hole → etching the window of the hole →CO2 laser drilling → removal of protective film → metallization of the h
The semi-molten solder paste is placed on the circuit board by the steel mold, and then the SMD components are pasted on it, and it is welded on the circuit board by reflow welding
The surface packaging technology is analyzed and studied for assembling the circuit board. And then we put it together and we make a finished product. That is to say printed circuit board blank after the patch
In the design of PCB boards for gigabit devices, a good signal integrity design requires the engineer to consider all aspects of the device, transmission line interconnection scheme, power distribution, and EMC.
High TG, high speed, high frequency, thick copper, thin dielectric layer and other special materials are used in high-rise board, which puts forward high requirements for inner line fabrication and graphic size control.
With the rise of the electronic industry, circuit board production and development has become a more and more important part of PCB proofing a circuit board is not simple, easy to say.
The impedance test template can automatically generate a custom impedance template that changes with time according to the circuit characteristics on PCB, as shown in Figure 5. In this way, the special PCB wiring can be accurately judged and detected, suc
At present, for PCB curing, the most suitable use or UV light source, because UV light source has the characteristics of other mercury lamps do not have, just take the light source, UV light source is a cold light source, the curing principle is that the
The mechanical driving part is driven by the CAM spindle to drive the feeding mechanism, and the striking arm of the feeder is quickly found. The ratchet connected with it drives the component braid forward a distance through the connecting rod, and drive
In addition, the process can prevent hydrogen embrittlement, because the process does not form a closed space, which helps to prevent acidic materials during plating from being trapped inside the workpiece, thus preventing hydrogen elements from entering
In the power supply circuit, the positive electrode of the electrolytic capacitor is connected to the output terminal of the power supply when the positive voltage is output, and the negative electrode is grounded.
Especially for RF performance, customers do not need to invest manpower and material resources for antenna matching design and anti-interference design of PCB research and development and trial production.
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