SMT plant will introduce you how to make tin full on PCBA proofing
If before use, the solder paste is not fully stirred, the flux and tin powder is not fully integrated, then it will also lead to some solder joints of the tin is not full.1
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What role does AOI testing play in PCBA processing
AOI testing can also help optimize the process and production efficiency of PCBA processingThrough the automatic inspection of PCBA board, the quality and consistency in the machining process can be monitored and controlled in real-time. If a problem is d
SMT patch processing needs to pay attention to several standard problems
The first point: size error problem second point: component offset problem third point: temperature control problem Fourth point: PCB board surface treatment problem
The function and precautions of PCBA splitter in PCBA processing plant
Cutting PCB board 2. Precise control of cutting position and Angle 3. Help to improve production efficiency. Reduce material waste 1. The correct positioning of the splitter 2. Safe use 3. Ensure the quality of materials
Selection of welding wire for circuit board welding
Circuit board names are: circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printing (copper etching technology) circuit board.
Dynamic setting of threshold voltage
The experiment shows that the detection circuit can measure and record the path relationship between the pins of each component on PCB efficiently, accurately and completely with the support of the measurement and navigation software (described in another
Machine vision detection PCB board than the advantages of human eyes
Printed circuit board (PCB) is an information carrier integrating various electronic components, which has a wide range of applications in the field of electronics. Its quality directly affects the performance of products. In the process of PCB manufactur
High frequency and high speed demand
PCB for high frequency, high speed transmission needs, in addition to circuit design to reduce signal interference and loss, maintain signal integrity, and PCB manufacturing to maintain in line with the design requirements, it is important to have a high
Development of substrates for printed circuit boards
HDI board technology is characterized by BuildingUpProcess, commonly used resin coated copper foil (RCC), or semi-cured epoxy glass cloth and copper foil lamination is difficult to reach fine lines.
Innovative from the fundamental improvement of technology level
brush roller suction stick pollution glue stains, blow-dry drying section of wind knife fan viscera, oil dust, etc., the surface of the board film or improper dust removal before printing, development machine development is not clean, poor washing after d
Common problems and solutions of PCB electroplating copper sulfate process
Copper plating is the most widely used in order to improve the adhesion of the coating and a kind of precoating, this paper we will introduce the copper plating technology in PCB process encountered common problems and their solutions.
Look at PCB board industry development from electronic information industry current situation
PCB board conductive circuit pattern is not balanced or PCB board two sides of the circuit is obviously asymmetrical, one side has a large area of copper skin, the formation of greater stress, the PCB board warping, in the process of PCB processing temper
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