PCB engineering design requirements
The shelf life of PCB made by OSP process and pure gold sinking process is generally 6 months after packaging. Baking is not recommended for OSP process.
The shelf life of PCB made by OSP process and pure gold sinking process is generally 6 months after packaging. Baking is not recommended for OSP process.
Hot air smoothing is to dip the printed circuit board into the molten solder (63SN/37PB), and then use the hot air to blow off the excess solder on the surface of the printed circuit board and in the metallized hole, to obtain a smooth, uniform and bright
The domestic leading automobile board represented by Shanghai Electric Company has actively participated in international cooperation and introduced advanced technology. The high-frequency PCB used for millimeter wave radar has been mass-produced.
The size of the welding nozzle should be as large as possible to ensure the stability of the welding process and not affect the adjacent components on the PCB, which is important to the design engineer, but also difficult, because the stability of the pro
The grounding isolation belt near the crystal oscillator must be well grounded. In a word: the copper coating on PCB, if the grounding problem is handled well, is certainly "more advantages than disadvantages", it can reduce the signal line back...
PCB is the mother of electronic products. As long as the electronics industry continues to develop, there will always be business opportunities, and if it can survive the trough, it will meet the peak.
it is generally sufficient to handle high end harmonics and keep the transient signal low enough, that is, common-mode EMI can be dropped very low. The PCB layer-stack design example presented in this paper will assume layer spacing of 3 to 6mil.
1, PCBA processing equipment, 2, PCBA processing plant environment, 3, PCBA processing technical service ability, 4, PCBA processing finished product packaging, 5, assess the overall strength of PCBA processing plant, 6, PCBA processing price and delivery
The larger the number of turns of common mode choke, the larger the parasitic capacitance and the worse the effect of high frequency isolation.
Local collision occurs in PCB process, and the copper wire is separated from the substrate by external mechanical force. This defect manifests as poor positioning or orientation, falling copper wire will have obvious distortion, or in the same direction o
With the expansion of 5G commercial pace, the upgrading of consumer electronic products and the emergence of new applications, the further growth of Internet traffic, and the increasing demand for switches and servers driven by the construction of data ce
With the expansion of 5G commercial pace, the upgrading of consumer electronic products and the emergence of new applications, the further growth of Internet traffic, and the increasing demand for switches and servers driven by the construction of data ce