Cause analysis of PCB board defects
This will break the solder joints, bend the shape of the board, or it may cause the copper thread on the board to break.
Professional PCB manufacturing and assembly
Building 6, Zone 3, Yuekang Road,Bao'an District, Shenzhen, China
+86-13923401642Mon.-Sat.08:00-20:00
Understand PCB laminated design
It is important to note that the power layer should be near the layer that is not the main component plane, because the bottom plane will be more complete. Therefore, EMI performance is better than the first scheme.
The material that can make high speed PCB should meet these 5 requirements
Choose as large a component as possible when designing the power resistance, and adjust the layout of the printed board to allow enough space for heat dissipation.
Have a sense of discovery
Do PCB board with the rapid development of semiconductor, each product may exist in the processing process and requirements of the difference, not to mention our production conditions may with time,
Dongguan Chang 'an circuit board processing
Peel off the bad part of the copper wire to see the copper foil surface, you can see the normal color of the copper foil surface, there will be no bad side erosion, copper foil peeling strength is normal.
Domestic EDA needs to do is to break each other
Connectivity through holes For multi-layer circuit boards to conduct connectivity tests, the purpose is to find out whether the PCB graphics have connectivity.
Shanghai circuit board processing
In the process of board making, there are several processes to go through the yellow light room. The visual effect of green in the yellow light room is better, but this is not the main.
Choice of inductor or transformer
Some do not notice this phenomenon, directly adjust the sense resistance or working frequency to reach the required current, which may seriously affect the service life of LED.
Microelectronic devices
These products and solutions can be applied to mobile devices such as smartphones, tablets and wearables, as well as high-speed data communication devices.
Rf circuit board machining
The flow rate of the glass discharge tube should be greater than the flow capacity of the lightning protection circuit design.
They are also working on the rise of homegrown EDA
These products and solutions can be applied to mobile devices such as smartphones, tablets and wearables, as well as high-speed data communication devices.
Opportunities for domestic PCB manufacturers to engage with the process
The layout of the basic structure such as PAD, design rule check (DRC), parameter extraction (EXT) and layout circuit control (LVS) associated with the design tool are the key to the successful production of the designed chip in the wafer factory. This is
Telegram
Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.