What is BGA welding
As the function requirement of electronic products is higher and higher, the volume requirement is smaller and smaller. In order to meet this need, the welding ball array packaging technology appears.
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PCB boards are widely used in the field of automatic testing of printed circuit boards
PCB board test system will have a new design idea, the use of automatic test system based on USB bus and virtual instrument design idea, give full play to the role of the computer
What is the production process of PCB multilayer pressing?
The platen method of this new concept is called "mass platen" or "large platen". In recent years, there have been many professional OEM pressing industry.
Production experience of halogen-free PCB printed circuit boards
Halogen-free PCB printed circuit boards have low water absorption and meet the requirements of environmental protection, in other performance can also meet the quality requirements of PCB board.
pcb circuit board copper plating surface foaming what causes
Based on many years of actual production experience and service experience, the author now makes a brief analysis of the causes of bubbling on the copper plating surface of the circuit board.
What are the most important procedures and processes for customer assessment of SMT process?
In terms of the overall process capability of SMT today, the solder paste printing ability is the worst. Because the solder paste printing more or less or the printing offset are related to the quality of the solder behind, it is the most need to be speci
Common component repair
In PCBA processing, there are mainly three kinds of commonly used electronic components repair: Chip component repair, multi-pin device repair and BGA repair.
Cause analysis of solder paste viscosity reduction on circuit board
The so-called solder paste low viscosity phenomenon refers to the phenomenon that the parts have no way to be glued to the solder paste during or after the punching.
Diagnosis and treatment of common poor printing
In the process of PCBA processing, there are often some problems of poor printing: tin, tin infiltration, tin paste collapse, tin paste powder, tin paste tapering, less tin, more tin, offset.
What are the contents of PCB incoming material inspection
The content of PCB incoming material inspection includes PCB size and appearance inspection, PCB warping and distortion detection, PCB weldability test, PCB solder resistance film integrity test, PCB internal defect detection.
Green manufacturing is the main direction of PCB industry development
Although PCB can be called a high-tech product in the electronics industry, but now the development of PCB is not only challenged by its own cost-effectiveness problems, more is from the challenge of energy conservation and environmental protection.
SMT proofing small batch processing price is high
The reason for the high price of SMT proofing in small batches: The proofing cost of small batches of SMT mainly includes start-up fee, engineering fee, steel mesh fee, processing fee calculated according to conventional points, or summarized directly wit
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