Circuit designers and technicians of products must master and follow PCBA manufacturability design procedures. Following PCBA manufacturability design procedure is the first prerequisite for product manufacturability design.
through the titanium electrode rolling plating method to carry out the first and second rolling plating, improve the thickness of the copper layer to enhance the actual effect of the conductivity of the guide hole.
the control of hydrochloric acid concentration value need not be slightly lower, the current intensity is slightly higher, not only the amount of the area and hemp sand can be defeated.
Ensure the machining accuracy and assembly accuracy of guide column and guide sleeve; Reduce the fit gap between the shape of pusher plate and the die, and make the shape of pusher plate consistent with the concave and convex shape.
Common heat dissipation mode of circuit board: 1, high heating device plus radiator, heat conduction plate, 2, through the circuit board itself heat dissipation, 3, the use of reasonable design to achieve heat dissipation function, 4, for the use of free
When printing plate is printing solder paste, there is a certain restrictive relationship between scraper speed, scraper pressure, scraper and mesh plate Angle, release speed and solder paste viscosity.
In PCB processing and production, static electricity is not the hazard, the real danger lies in the accumulation of static electricity, and the resulting electrostatic discharge.
In the process of production, packaging and transportation, and the processing, debugging and testing of the integrated machine, it is inevitable to suffer from external or own friction and form a high surface potential.
There are two important concepts in IPC-SM-782, "Producibility Levels" and "Component Mounting Complexity Levels", which are different but have corresponding three levels.
The concept of DFM was first proposed in 1995 by the American Federation of Fittings Association and introduced into China in the late 1990s. "Circuit manufacturability design" is a new design concept put forward in 1998.
The current wave soldering is usually composed of plate loading system, flux coating system, preheating system, welding system, electrical, mechanical structure system structure system.
According to the requirements and requirements of failure analysis, it is necessary to adopt various analysis techniques and methods to determine the location of failure, the degree of failure, the cause and mechanism of failure.
Telegram
