SMT patch processing quality precautions and solutions
In the SMT process, there are six mounting quality problems that need attention: 1, mount design qua...
In the SMT process, there are six mounting quality problems that need attention: 1, mount design qua...
5 PCBA processing automation production of PCB size, shape, transmission edge, positioning hole, pos...
◆ Main factors affecting the viscosity of solder paste: 1. Shape and temperature, 2. Thixotropic coe...
In the process of electronic machining, the smaller the Angle of the scraper affects the vertical fo...
Component layout shall be designed according to SMT electronic processing production equipment and p...
The quality of reflow welding is affected by many factors, the most important factor is the temperat...
The cleaning quality detection methods of PCBA are as follows: 1. Test methods of ion pollutants: (1...
Significance of PCB cleaning after surface mounting welding: 1. PCB cleaning after surface mounting ...
Different welding resistance film due to the composition, content is different, and coating bonding ...
When adding solder paste to patch processing, there are four main requirements: 1, must be uniform, ...
To provide you with effective skills to improve PCB design spread rate and design efficiency: 1, det...
One of the major trends of PCB design is gradually inclined to open source hardware mode and control...