Analysis of bypass capacitance in high speed PCB
Only each module has good EMC and low EMI can ensure the realization of the whole system function.
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The 20H principle in PCB design
Because the wider the printed line is, the smaller the inductance is, the lead line from the pad to ...
PCB copy board process some small principles
PCB copy board process some small principles :1, printed wire width selection basis: 2, line spacing...
Printed circuit boards and lead-free assembly requirements
Why is lead not allowed on printed boards, assembly processes and products? There are two reasons fo...
The technology and material problems of PCBA solder - free pressing - in connection
The key factors of PCBA crimping technology are as follows: (1) crimping end; ② Printed board; ③ cri...
SMT patch processing technology: Causes of component displacement in patch processing
The reasons for component displacement in patch processing are as follows: 1, the use time of solder...
Reverse deformation mounting of printed circuit board components
During the installation of the reinforced frame and the PCBA, and the installation of the PCBA and t...
Why should the PCB board plug the hole?
In order to meet customer requirements, the circuit board must plug holes through the hole, after a ...
SMT patch component stele causes and solutions
Factors affecting the printing thickness of solder paste: reduce the thickness of steel mesh plate, ...
PCB production to do the role of the board and board edge
General circuit board production will be carried out board work, its purpose is to increase the prod...
SMT manufacturer PCB surface to find the reason of PCB coppered laminate
According to the activity of flux, it can be divided into active (RA), medium active (RMA), inactive...
Advantages of SMT surface assembly technology
SMT technology has only a history of more than 40 years. It has gone through the journey from birth,...
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