AOI application strategy for SMT patch production
Application scope: SMT, LED, BGA, CSP flip chip testing, semiconductor, packaging components, lithiu...
Application scope: SMT, LED, BGA, CSP flip chip testing, semiconductor, packaging components, lithiu...
Common PCB welding pad over wave soldering defects have the following points: (1) board surface dirt...
In the dispensing process, the technical parameters of the patch glue and the dispensing machine can...
The establishment of more and more circuit board recycling plants, to a large number of waste circui...
A perfect PCB board not only needs to do the component selection and setting is reasonable, but also...
10 advantages of soft PCB: flexibility, reduce volume, reduce weight, consistency of assembly, incre...
The simplest multilayer soft PCB is a three-layer soft PCB formed by two layers of copper shielding ...
In the SMT process of the PCB manufacturer, the solder paste printing, the operation of the SMT mach...
The rapid development and popularization of SMT processing has played a unique role in promoting the...
Patch processing manufacturers will determine whether to make solder paste steel net or red rubber s...
Take a look at BAG difficult chip repair process, requirements for equipment, personnel: 1, rework r...
Some measures can be taken to clean the tail of PCBA production and processing to improve work effic...