Optimization design technique of circuit board heat dissipation
Optimization design skills of circuit board heat dissipation :1. Heat dissipation by PCB board itsel...
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PCB design and manufacturing guide
Surface mount technology is very convenient in the manufacture of many PCBS. Reliable and fast profe...
SMT patch processing features
SMT patch processing main characteristics: 1, high density: 2, small aperture: 3, low coefficient of...
How does PCB design handle signals across dividers?
Common treatment methods are added sewing capacitor and bridge :1, sewing capacitor, 2, bridge, 3, m...
Manual welding method for SMT patch processing of leadless chip components
Manual welding methods for SMT patch processing of leadless chip components: one by one welding spot...
From the welding point of view, what problems should be paid attention to in PCB design?
There are the following factors affecting PCB welding quality: PCB diagram, circuit board quality, d...
Should PCB design remove dead copper?
PCB design service process: 1. The customer provides schematic diagram to consult PCB design; 2. 2. ...
In PCBA processing, which situations need to use post-welding processing?
The reasons for the need for post-welding processing are as follows: 1, the components are not resis...
What are the main contents of SMT SMT technology
SMT SMT technology: The main content of surface assembly technology can be divided into four parts: ...
SMT patch production process
SMT basic process elements include: screen printing, mounting (curing), reflow soldering, cleaning, ...
MCP POP with SIP package
Factors affecting the quality of BGA patch assembly: 1. Feasibility of BGA pad design, 2. The throug...
How does smt plant control PCBA quality?
Aluminum substrate and glass fiber plate difference and applicationFirst, glass fiber board (FR4, si...
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