Harm of phosphorus moisture content in Pcb to anodized phosphorus film
the control of hydrochloric acid concentration value need not be slightly lower, the current intensi...
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How to reduce ESD interference in PCB design process
in the design of PCB board, PCB anti-ESD design can be realized by layering, proper layout and wirin...
The difference between aluminum substrate and FR4 plate
Aluminum substrate and FR4 board are two common PCB board, aluminum substrate is commonly used as LE...
The debugging procedure and method of PCBA machining circuit board
PCBA machining circuit board debugging steps and methods: 1. Board surface observation and resistanc...
Circuit board PCBA processing process is introduced
Circuit board PCBA processing process can be roughly divided into: empty plate loading - printed sol...
How to reduce the surface tension and viscosity in PCBA welding
Pay attention to the wiring of signal lines under the magnetic beads, between the pads and those tha...
PCB punching common defects and solutions
Ensure the machining accuracy and assembly accuracy of guide column and guide sleeve; Reduce the fit...
Four methods of proofing aluminum substrate
Four proofing methods of aluminum substrate: one, photographic material proofing method, two, mechan...
Reasons for indented design of GND layer and power layer in multi-layer PCB design
Only under certain conditions can the 20H principle have obvious effects. 1. The power plane shall b...
PCBA processing welding resistance film common causes of bad
Common bad reasons for PCBA welding resistance film processing :1. Welding pad and through hole conn...
What is the meaning of "false eight layers" in PCB design?
The difference between them is that the core is thinner, the pp sheets of one or two layers and five...
PCB design requirements for screen printing design
The characteristics of the gold process: the copper on the circuit board is mainly copper, copper so...
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