PCB hole without bad copper analysis
high heat dissipation devices in connection with the substrate should be able to reduce the thermal ...
high heat dissipation devices in connection with the substrate should be able to reduce the thermal ...
To evaluate the heat dissipation capacity of PCB, it is necessary to calculate the equivalent therma...
Circuit board system interconnection includes chip to circuit board, PCB board interconnection and s...
A combination of ultra-fine wire etching, metallization, and microporous interconnect processes enab...
In the process of PCB high-speed signal circuit design and wiring, engineers need to shorten the lea...
The microstrip line consists of a fixed length of metal or wire and the whole or part of the ground ...
This means that the board's thermal expansion and contraction can be maintained at a stable limit at...
The insulating substrate may be polyimide, polyethylene terephthalate, arylamide fiber ester and pol...
In the future, with the emergence of new demands for automotive electronics, data centers and artifi...
The UV laser precisely cuts the blind slots of the target layer separated from the multilayer circui...
Each circuit layer in the multilayer circuit board is pressed together by the action of semi-cured s...
Any other design tricks such as considerably reducing the length of the goldfinger, terminal matchin...