OSP membranes have been used in circuit boards for many years as organomaterials formed by the reaction of azole compounds (azole) with transition metal elements, such as copper and zinc.
Counterpoint when hands take, put the board, strictly avoid board and board superimposed together, or board and counterpoint table friction, avoid scratching the board surface.
the exposure machine Myra film due to use time is longer, there is scratch phenomenon on the film surface, scratch accumulation dust form black or opaque "small lines", in line graphics exposure due to black or opaque "small lines" sha...
Therefore, copper can be used as the base of electrodeposition of many metals, and copper plating plays an important role in the production process of printed board.
When adjusting the width of the guide rail, pull out all PCB supporting thimbles. There should be no PCB at the entrance and exit ends to prevent damage to the guide rail. After adjusting the width of guide rail, adjust the width of guide rail of buffer t
The influence of connectors should be considered especially in the design of gigabit system PCB. Nowadays, the development of high-speed connector technology can guarantee the continuity of impedance and ground plane during signal transmission.
Since the IBIS model is not suitable for describing active circuits, it is not suitable for many Gbps devices that have pre-weighted circuits to compensate for loss.
Therefore, this requires the designer in the circuit design, should first understand the feasibility of the process, as far as possible to achieve the entire board circuit graphic uniform distribution, wire thickness should be consistent as far as possibl
For high - level circuit board processing technology research literature, the industry is relatively few. This paper introduces material selection, laminated structure design, interlayer alignment, inner line production, pressing process, drilling process
it can not be continuously found that the boot phenomenon, after maintenance, the cause of the fault has a certain common, basically is the bottom of the power board between the solder joint sticky dirt, resulting in circuit leakage caused by fault.
At the same time, make the direction of the power line, ground line and the direction of the current, which helps to enhance the anti-noise ability. Grounding is the bottom branch of the four current circuits of the switching power supply.
The circuit board with devices on both sides should be taken into account the second time over reflux will be welded side of the side of the device off, serious will rub off the pad, destroy the circuit board.
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