In high-speed PCB, with the increase of the transmission frequency of signal, the capacitive impedance between wires decreases and the inductive impedance on the wires increases, and the signal wire will no longer be presented as pure resistance, that is,
The PCB should be inserted into the chassis. Do not install the PCB in the open position or inside joints.
PCB waste water is divided into cleaning waste water, ink waste water, complexing waste water, concentrated acid waste water, concentrated alkali waste water.
Package of integrated circuits in which the input and output points are tin balls arranged in a grid pattern on the underside of the component.
In addition, it is important to have the signal layer adjacent to the loop layer, that is, the board layout is signal, ground, signal, signal, power, ground, signal, signal, signal, signal.
In the case of the IC on our circuit board, the power layer around the IC can be regarded as a good high-frequency capacitor, which can collect the energy leaked by discrete capacitors that provide high frequency energy for clean output.
The package of hybrid circuit can adopt the base and cover of cutting metal, parallel seam welding, with good shielding effect.
the boundary scanning method has special advantages when there is no test model or the nodes of the contact circuit are limited.
Odd layer PCB needs to add non - standard laminated core layer bonding technology on the basis of nuclear structure technology. Compared with the nuclear structure, the production efficiency of the plant adding foil outside the nuclear structure will decr
Opening, drying board, mechanical drilling blind buried hole, copper sinking, full plate plating, inner graphics, plating holes, inner graphics, inner etching, inner AOI, brown, laminating, drying board, milling, removing glue, drilling, normal process
drying board, mechanical drilling for buried holes, copper sinking, full plate plating (negative film process, plating to the required copper thickness), inner graphics, inner etching, inner AOI, brown, laminating, drying board, milling edge, drilling (L2
The above is the overview of optical module PCB and optical device simulation. There are not many things to simulate, but there are also many places to be carefully handled.
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