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PCB manufacturing

PCB manufacturing

Maintenance of pcb etching equipment
16Apr
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Maintenance of pcb etching equipment

The formation of residual film slagging indicates that the previous film removal process is not thorough. Poor film removal is often the result of the combination of edge film and electroplating.

Simulation of mixed signal PCB
16Apr
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Simulation of mixed signal PCB

The shortest and widest printed line permitted by the assembly process shall be used. For high frequency devices, the printed line of the power supply is equivalent to a small inductance, which will worsen the power supply noise and cause undesired coupli

How to improve the thermal reliability of PCB boards
16Apr
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How to improve the thermal reliability of PCB boards

They not only play a conductive role in the design, but also play the role of heat conduction, its thermal conductivity and heat transfer area are relatively large circuit board is an indispensable part of the electronic circuit, its structure is composed

How to deal with PCB sensitive circuit? What are the interference elements?
14Apr
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How to deal with PCB sensitive circuit? What are the interference elements?

Compared with the microstrip, the ground coplanar waveguide circuit has the characteristic of low dispersion, and the radiation loss of the ground coplanar waveguide circuit is lower than that of the microstrip circuit when the frequency rises to the mill

Why do photoelectric components on PCBS always fail?
14Apr
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Why do photoelectric components on PCBS always fail?

PCB has become the most important and key part of electronic information products. Its quality and reliability level determine the quality and reliability of the whole equipment.

Detailed back drilling process in PCB circuit board production
13Apr
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Detailed back drilling process in PCB circuit board production

In China, the demand for backplanes mainly comes from the communications industry, which is now growing in the field of communications equipment manufacturing.

The deformation of the two core plates is respectively
13Apr
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The deformation of the two core plates is respectively

The difference of expansion and shrinkage in the pressing process will be retained through the solidifying process of semi-cured sheet and eventually form the deformation of PCB board.

High Tg products are significantly better than ordinary PCB substrate materials
13Apr
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High Tg products are significantly better than ordinary PCB substrate materials

It has many advanced features, capable of simulating laminar and turbulent flow as well as multi-type analysis, including radiation and convection. Icepak offers a huge library of fans, radiators and materials that provide solutions to everyday electronic

What will be the challenges of advanced packaging and circuit board reliability
13Apr
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What will be the challenges of advanced packaging and circuit board reliability

Big data and artificial intelligence are making humans more dependent on electronic systems, and will make reliability deficiencies even more deadly. At DesignCon 2020 recently, I had the opportunity to learn how ANSYS enables engineers to design highly r

Ground mode in multilayer PCB board
13Apr
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Ground mode in multilayer PCB board

In the ground plane segmentation and signal routing, the distribution of ground plane and important signal routing should be taken into account to prevent the problems caused by the ground plane slotting.

Cause analysis of no copper in PCB hole sinking copper
13Apr
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Cause analysis of no copper in PCB hole sinking copper

The following is my personal opinion and control method of the hole without copper open circuit. The reason for the absence of copper in the pore is nothing more than。

In electroplating copper, electroplating lead tin (into pure tin) is associated with voids
12Apr
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In electroplating copper, electroplating lead tin (into pure tin) is associated with voids

These organic compounds, such as derivatives of caprolactam, may participate in REDOX reactions, stripping away the atomic hydrogen before forming hydrogen molecules, preventing bubbles from forming. The reduced pitting additive is reoxidized at the anode

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