On the difference of circuit board each surface treatment process
Spray tin is divided into lead spray tin (i.e. hot air flat) and lead-free spray tin. Below you can see the difference between the various processes;
Spray tin is divided into lead spray tin (i.e. hot air flat) and lead-free spray tin. Below you can see the difference between the various processes;
Many customers use pad(plug-in holes) to represent conductive holes, thus causing your conductive holes to open the window. Then please check your document design! At this point in time,
Radio-frequency radiation is a combination of this magnetic and electric field. Magnetic and electric fields leave the PCB structure by means of radiation or conduction.
In PCB, EMI can be produced for many reasons, such as: RF current, common mode level, ground loop, impedance mismatch, magnetic flux
In addition, with the increase of width, PCB current-carrying capacity does not increase strictly in line with the linear increase
Any circuit board material used in millimeter-wave circuits should have a low TCDk value to minimize the impact of Dk changes on circuit performance (such as phase shift).
the thermal performance index analysis software module added in some professional PCB design software can help designers optimize circuit design.
there are still some differences between high frequency products and high speed products in the demand for plate.
At present, the use of polyphenyl ether (PPO or PPE) resin is a good development direction, whether from high frequency materials or high speed materials.
TPM and other high-end knowledge, but ignore the field management, ignore the most basic production activities of the people and equipment.
The following is its structure diagram (about circuit symbols and functions will be explained later) :IC design: CMOS devices and their circuits,
The following are the main points and points for attention in selection of PTC self-restoring fuses of overcurrent devices arranged by Shuokai Electronics.