whether it is dry method or wet method, if suitable method is selected according to the characteristics of the main material of the system, the purpose of drilling and etching of rigid torsion interconnection mother plate can be achieved.
In addition, before the solder resistance film coating, the printed circuit board surface is treated by plasma, and a certain roughness and high activity surface can be obtained, so as to improve the adhesion of the solder resistance film.
The chemical residue in the gold settling process can be left in the hole where the plug hole is not sufficient, causing problems such as weldability.
The multilayer soft PCB board made of polyimide film as the base material is about 1/3 lighter than the rigid epoxy glass cloth multilayer PCB board, but it loses the excellent flexibility of single-sided and double-sided soft PCB. Most of these products
There is no significant relationship between the generation of bulge and construction area, the same area some severe, some light, some intact.
There is no denying that current industry trends and consumer demands are pushing designers and design teams to push the envelope and develop new electronic products to meet market challenges.
The development of the electronics industry also promotes the development of PCB, which also puts forward higher requirements for the production process and surface mounting technology of printed board.
The results show that the latest organic coating technology can maintain good performance in multiple lead-free welding processes.
That is to say, the digital-to-analog undivided way can only be used when the analog circuit area is far away from the digital circuit area that generates large noise.
The dielectric constant of substrates and prepreg materials using epoxy glass can be controlled by changing the percentage of resin content.
The resistance value of the terminal resistance should match the characteristic impedance of the line. This can be done manually or by CAD tools to calculate the characteristic impedance value and the terminal matching resistance value.
In the actual study, we can conclude that there are four main interference, including power supply noise, transmission line interference, coupling and electromagnetic interference (EMI). Through analyzing various interference problems of high frequency PC
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