The removal of copper from the through-hole can be caused by chemical factors, such as etching, or mechanical causes, such as blow-holing, stress cracking, or deposition detachment.
manual wiring is and will be an important process in PCB design. Manual wiring is helpful for automatic wiring tools to complete the wiring work. By manually routing and fixing the selected net, a path can be formed for automatic routing.
PCB demand in the computer field can be divided into PC and service/storage and other segments, in which the PC market is basically saturated and the growth rate is relatively slow, while the service/storage market scale is growing rapidly.
PCB circuit opening and short circuit are the problems encountered by PCB manufacturers almost every day, which has been troubling the production and quality management personnel.
Too low density of alkaline etching solution will aggravate side erosion, choosing etching solution with high copper concentration is very beneficial to reduce side erosion.
high heat dissipation devices in connection with the substrate should be able to reduce the thermal resistance between them.
In the future, with the emergence of new demands for automotive electronics, data centers and artificial intelligence, PCB industry will usher in new growth points.
Any other design tricks such as considerably reducing the length of the goldfinger, terminal matching, Daisy chain connections or branch connections are designed to ensure that the signal sees a consistent instantaneous impedance.
The input and output impedance of the IC after replacement should match the original PCB circuit; Check its driving ability,
The key of RF circuit PCB design is how to reduce the radiation ability and how to improve the anti-interference ability, reasonable layout and wiring is the guarantee of the design of RF circuit PCB.
Even if the oxidation after a long time of use will almost only occur in the insertion and removal of the connection part, and there is no impact on the welding pad and the welded components.
There are many factors causing the coating cavity, the most common is PTH coating cavity, by controlling the relevant process parameters of the potion can effectively reduce the generation of PTH coating cavity.
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