PCB copy board four basic steps
PCB copy board design step two: Draw your own definition of non-standard device package libraryIt is suggested to put the devices drawn by yourself into a dedicated design file of PCB library.
PCB copy board design step two: Draw your own definition of non-standard device package libraryIt is suggested to put the devices drawn by yourself into a dedicated design file of PCB library.
Many people misunderstand the concept of PCB copying board. In fact, with the continuous development and deepening of the copying board industry, today's concept of PCB copying board has been extended in a wider range.
The onboard antenna needs to be placed at the edge of the board and where the antenna area is located. Copper foil exclusion zones are required for all layers, and the antenna should be separated from the ground plane of the PCB.
PCB circuit boards play an important role in life today. It is the foundation of electronic components and the highway. In this regard, the quality of the PCB is critical.To check the quality of a PCB, a number of reliability tests must be performed. The
The dimensional stability of multilayer PCB is the main factor affecting the positioning accuracy of the inner layer. The effect of thermal expansion coefficient of substrate and copper foil on the inner layer of multilayer PCB is also considered.
Rich experience in copying board on the basis of guaranteed success rate, but also can finish the work of copying board faster. High efficiency and high success rate make subroutine electronics highly praised in the industry.
With the reduction of the aperture, the original debris that has no effect on the larger aperture, pcb board factory, such as brush debris, volcanic ash, once remaining in the hole, will make the chemical precipitation of copper, copper plating will lose
Even the well-written and actually implemented technical specifications for PCB laminates do not specify the test items that must be carried out to determine that PCB laminates are the cause of manufacturing process problems.
The holes on the circuit board are divided into overcurrent holes, plug-in holes and installation holes.
Copper coating can not only reduce the ground impedance, but also reduce the cross-sectional area of the loop and enhance the mirror loop of the signal. Therefore, copper coating process plays a very key role in PCB process, incomplete, truncated mirror l
After a lot of practice, the traditional aluminum plug process is changed, and white mesh is used to complete the circuit board surface welding and plug holes. Stable production and reliable quality.
This article is a summary of the author's experience in the actual development, hoping to help many RF IC developers shorten the development cycle, avoid unnecessary detours, save manpower and financial resources