Board bubbling is one of the most common quality defects in PCB production. Because of the complexity of PCB production process and process maintenance, especially in chemical wet treatment, it is difficult to prevent board bubbling defects.
The abnormal quality of PCB board will cause direct losses to customers and PCB manufacturers. The loss of copper wire is one of the abnormal quality phenomena, but this kind of abnormal will cause greater losses to PCB manufacturers.
The PCB industry has been shifting its focus to Asia, gradually forming a new pattern with Asia as the center and other regions as the auxiliary. The Asian continent has become the main production base of PCB and its high-end products HDI in the world.
For electronic equipment, a certain amount of heat will be generated when working. If the heat is not dissipated in time, the equipment will continue to heat up, and the devices will fail due to overheating.
In the high speed signal transmission line of printed board wire, one is the high frequency signal transmission class of electronic products, the other is the high speed logic signal transmission class of electronic products.
The chips are welded to the circuit board by soldering, and the circuit board is "wired" to establish the electrical connection between the chips.
The expansion and shrinkage of flexible plate materials are mainly related to matrix material PI and glue. The higher the degree of iminization, the stronger the controllability of expansion and shrinkage.
The soft and hard combined board is made of two groups of hard cover plate on the upper and lower surfaces of the circuit board, among which one or more layers of FPC are sandwiched in the middle, and the cover plate area is maintained as no line.
Because some standard thickness of the circuit board is not the same size, so the customer can measure some checks, according to their own product thickness and specifications, and then the light and color, in the external circuit board and ink cover, fol
With the continuous advancement of information and intelligent construction, the market demand for flexible circuit boards will be more and more large.
The expansion and shrinkage of flexible plate materials are mainly related to matrix material PI and glue. The higher the degree of iminization, the stronger the controllability of expansion and shrinkage.
The market share of FPC is increasing with the development of miniaturized and portable electronic products. However, FPC may have defects such as open circuit, short circuit and line width discrepancy in the process of processing, feeding and mounting.
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