Explore the best welding method of circuit board
The intermetallic bonds between copper and tin form grains whose shape and size depend on the duration and strength of the temperature at the time of welding.
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Five key points of PCB circuit board design!
Now PCB design time is shorter and shorter, smaller and smaller board space, higher and higher device density, extremely demanding layout rules and large size components make designers
How to measure the dielectric constant of PCB circuit board material at millimeter wave frequency?
While raw material test methods often introduce uncertainties related to test fixtures or test devices, circuit test methods include uncertainties from test circuit design and fabrication techniques. Because the two methods are different, measurement resu
PCB circuit board design and wiring principles
How to improve SMT SMT processing efficiency: first, advance work preparation, second, ensure the SMT SMT machine running time balance, third, equipment operating parameters
In 2020, the output value of the global printed circuit board will reach $66.1 billion
Local collision occurs in PCB process, and the copper wire is separated from the substrate by external mechanical force. This defect manifests as poor positioning or orientation, falling copper wire will have obvious distortion, or in the same direction o
In multilayer circuit boards
the production of controllable impedance boards is becoming more and more important.
PCB mixed signal circuit board design criteria
Avoid running digital clock lines and high frequency analog signal lines near the power layer; otherwise, the noise from the power signal will be coupled to the sensitive analog signal.
Detailed back drilling process in PCB circuit board production
In China, the demand for backplanes mainly comes from the communications industry, which is now growing in the field of communications equipment manufacturing.
Discussion on the cause and countermeasure of the hole wall coating cavity of circuit board
There are many factors causing the coating cavity, the most common is PTH coating cavity, by controlling the relevant process parameters of the potion can effectively reduce the generation of PTH coating cavity. But other factors can not be ignored, only
What will be the challenges of advanced packaging and circuit board reliability
Big data and artificial intelligence are making humans more dependent on electronic systems, and will make reliability deficiencies even more deadly. At DesignCon 2020 recently, I had the opportunity to learn how ANSYS enables engineers to design highly r
Discussion on the cause of bubbling on the surface of copper plating circuit board
Based on years of actual production experience and service experience, Now on the circuit board of copper plating surface foaming causes do a brief analysis, hope to help the industry peers!
The structure of the welding pad on the circuit board
A blind by-pass hole and a microvia hole are created in the pad to allow direct wiring to another layer. Because these bypass holes are small and blind, they do not suck up much solder, resulting in little or no effect on the amount of tin in the solder j
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