To evaluate the heat dissipation capacity of PCB, it is necessary to calculate the equivalent thermal conductivity (9EQ) of the insulating substrate for PCB, which is composed of various materials with different thermal conductivity.
The insulating substrate may be polyimide, polyethylene terephthalate, arylamide fiber ester and polyvinyl chloride.
Even many electronic design engineers are confused. This material will provide a brief and intuitive introduction to characteristic impedance, hoping to help you understand the rather basic qualities of transmission lines.
The parameters of PCB board layer, the distance between signal wires, the electrical characteristics of the driver and receiver end, and the connection mode of signal wires all have a certain influence on the crosstalk.
The input and output impedance of the IC after replacement should match the original PCB circuit; Check its driving ability,
whether it is dry method or wet method, if suitable method is selected according to the characteristics of the main material of the system, the purpose of drilling and etching of rigid torsion interconnection mother plate can be achieved.
it is easy to drill solder from the end of the covering layer to under the covering layer, especially when the bonding strength of the covering layer and copper foil surface is low, this phenomenon is more likely to occur frequently.
The multilayer soft PCB board made of polyimide film as the base material is about 1/3 lighter than the rigid epoxy glass cloth multilayer PCB board, but it loses the excellent flexibility of single-sided and double-sided soft PCB. Most of these products
The advantage of performing reception equalization in standalone devices is that it provides optimal wiring advantage and design flexibility.
The current approach is to increase the distance between the two signal layers and make the lines of the two layers as vertical as possible to avoid signal crosstalk between layers.
Shenzhen Princetron Circuit, as an innovative one-stop high-end electronic manufacturing services expert, will be committed to bring you more convenient experience, more intimate service and continuous innovation and progress!
Circuit board bubbling is actually the problem of poor binding force on the board, and then by extension, the surface quality of the board, which contains two aspects，
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