Circuit board design required data: 1. Circuit diagram, necessary, 2. Circuit consumption power calculation, not necessary, 3. Circuit diagram Electrical list, not required, 4. Component table, required, 5. Circuit board design drawing, required, 6. Circu
The causes of SMT printing leakage and tin deficiency are as follows: 1. Tin paste printing principle, 2. Observation, thinking, comparison, 3. Bare copper plate printing verification
Materials for PCBA electronic products patch processing: 1. Complete PCB board making file and board making requirements; 2. 2. Complete BOM, 3. PCBA assembly drawing, PS: report the cost of PCBA function test, and provide the method of PCBA function test
Width and spacing of printed wire are important design parameters, which affect not only the electrical performance and electromagnetic compatibility of PCB board, but also the manufacturability and reliability of PCB board.
The performance index of high frequency circuit directly affects the quality of the whole product. The layout and wiring of components can maximize the performance index of the circuit and achieve the design purpose of anti-interference.
Circuit board design and production process: 1. Preparation of production materials, 2. Circuit board production and manufacturing, 3. Production and design
When selecting circuit board components based on component packaging, the following needs to be considered: component packaging selection. Grounding methods. Virtual component packaging. Verify complete material list data. Sort. Excess gate circuit.
The PCB board where the component is placed is placed into the machine from one end. On a double-track conveyor belt, the circuit board of the newly placed component passes through the hot and cold zones of the reflow furnace, precisely controlling the me
In the increasingly fierce market competition at present, PCB manufacturers are trying to reduce the cost, in order to achieve a larger market share, in the pursuit of reducing the cost, often ignore the quality of the circuit board.
The effect of horizontal perforation electroplating in machining multilayer circuit boards is far inferior to that of vertical perforation electroplating.
The drawing maintenance method refers to the schematic diagram, analyzes the circuit principle and signal direction, and then tests the signals on the key points. Professional maintenance companies maintain circuit boards almost without drawing.
The final electrical conductivity, impedance test and solder and thermal shock tolerance test are carried out on PCB before packaging. And bake to eliminate the moisture and thermal stress absorbed by PCB in the process, and finally packaging and shipping
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