various components (chips, resistors, capacitors, inductors, plugs, fuses, etc.) will be welded or affixed to the PCB, so that it is together with the copper foil layer. To form a complete circuit.
Most copper crepe will occur in areas where the line density is different, especially where one side is designed to be large copper but the other side has a large empty area.
For different product needs, to strengthen effective quality control and maintain the due trust, we must first improve the technology, material development and overall manufacturing engineering quality control system to achieve.
In the past, circuit board factories have lost a lot of money because of this problem, and after a period of improvement, they disappeared without knowing what changes to solve the problem.
The direction of the circuit board into the tin and the direction of the tin wave is opposite, the solder liquid surface oxide too much affect the welding.
The common multilayer board is generally 4 or 6 layers, complexMultilayer board can reach dozens of layers.
There are some micro short circuit, short circuit phenomenon of PCB circuit board, with ordinary low-voltage computer testing machine can not guarantee its quality, once into the hands of users will affect our own credibility.
The deformation of the circuit board (PCBA board) usually comes from the rapid temperature rise and rapid temperature drop (thermal expansion and cold contraction) caused by Reflow。
usually in the process of high-speed PCB design, the seemingly simple holes usually bring great negative effects to the circuit design.
The cost calculation of PCB industry is the most special and complex in all industries. From opening, platen, forming, to FQC, packaging, completion and warehousing.
in fact, repair maintenance cost greatly increased at the same time, customer brand affected, It doesn't pay off in the long run.
Advantages: high assembly density, small volume, light weight because of high assembly density, the connection between components (including components) is reduced, so the reliability is improved; The number of wiring layers can be increased, thus increas
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