Halogen-free PCB printed circuit boards have low water absorption and meet the requirements of environmental protection, in other performance can also meet the quality requirements of PCB board.
Based on many years of actual production experience and service experience, the author now makes a brief analysis of the causes of bubbling on the copper plating surface of the circuit board.
The so-called solder paste low viscosity phenomenon refers to the phenomenon that the parts have no way to be glued to the solder paste during or after the punching.
Want to really fast production of high precision, good performance, and can save the cost of PCB circuit board, this is undoubtedly the biggest challenge for circuit design engineers.
At present, the PCBA processing and assembly of circuit boards are basically welded on the printed circuit board by soldering the electronic parts. This welding process can be achieved by SMT or wave soldering.
With the popularity of SMT lead-free process technology, the demand for PCB substrate is getting higher and higher. The performance of PCB can be improved from the design of PCB.
Circuit board is the necessary material of PCBA processing plant, circuit board is mainly to provide a carrier for various electronic components, and components link together to form a complete circuit.
Circuit designers and technicians of products must master and follow PCBA manufacturability design procedures. Following PCBA manufacturability design procedure is the first prerequisite for product manufacturability design.
PCBA machining circuit board debugging steps and methods: 1. Board surface observation and resistance check, 2. Install components, 3. Detect power supply output voltage, 4. Preset overcurrent protection current, 5. Install and test other modules
Circuit board PCBA processing process can be roughly divided into: empty plate loading - printed solder paste - mounting devices - reflow welding -AOI testing - receiving plate - finished product inspection - parts after welding - circuit board open/short
Common heat dissipation mode of circuit board: 1, high heating device plus radiator, heat conduction plate, 2, through the circuit board itself heat dissipation, 3, the use of reasonable design to achieve heat dissipation function, 4, for the use of free
The influence of human factors on manual welding of soldering iron is more. Machine welding, once the process parameters are adjusted, the production is very stable, but there are problems of welding temperature and welding time in manual welding.
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