Opening, drying board, mechanical drilling blind buried hole, copper sinking, full plate plating, inner graphics, plating holes, inner graphics, inner etching, inner AOI, brown, laminating, drying board, milling, removing glue, drilling, normal process
Electrolysis of copper foil is also used in situations where the carrying capacity of the current can be increased by increasing the weight of copper to achieve a copper width, such as planar inductors.
The most important factor when choosing a PCB laminate is to ensure that it is compatible with your RF and microwave PCB design requirements. For example, if you need high frequency performance, you may want to choose a material with a high dielectric con
Antenna return signal loss is an important consideration in RF and microwave PCB design. The return loss of any RF and microwave PCB board is defined as the power ratio between the forward and reflected waves at a given frequency.
Some modern features of the flexible PCB assembly process are that it includes the use of graphics and crimping tools. It has a flexible heater with a variety of additional possibilities.
The medical field is one of the most sensitive applications requiring PCBS because it requires precision, reliability, and high quality components. For this reason, medical PCBS are specifically designed to suit specific environments, laboratories, and te
Virtually every electronic product consists of one or more printed circuit boards (PCBS). PCBS immobilize IC and other components and interconnect them. A large number of PCBS were created for portable electronic devices, computers and entertainment devic
Design used to pay attention to the visual effects of the board, now is different. The automatic circuit board design is not as beautiful as the manual design, but the electronic characteristics can meet the requirements, and the complete performance of t
Careful analysis of the design and careful setup of the tools and software before wiring will make the design more in line with the requirements. The following is the general design process and steps.
EOS failure (left) compared to ESD failure of a single transistor (right). Note that ESD failure can cause a short circuit between the collector and emitter region.
In the electronics industry, collaborative work by interdisciplinary teams is critical to successful product development. The expertise of an electronic design specialist needs to be backed up by mechanical and electrical capabilities to create powerful p
Note that this is easier on thinner mediums, where the correspondence between characteristic trace widths and odd-mode trace widths will not be nearly the same.
Telegram