The test circuits are based on a microstrip transmission line structure with a through-hole in the middle of the circuit used as a conductor and signal transition from the top copper layer of the dielectric substrate material to the bottom copper layer.
Nickel-gold plating is the ancestor of the PCB surface treatment process. It has been around since the appearance of PCBS and has slowly evolved into other methods. It is the PCB surface conductor is first coated with a layer of nickel and then coated wit
Therefore, electroless nickel plating/gold leaching is to coat the copper surface with a thick layer of good electrical nickel gold alloy, which can protect the PCB for a long time; In addition, it has environmental tolerance that other surface treatment
The impedance and loss of PCB are crucial to the transmission of high-speed signals. In order to analyze such a complex transmission channel, we can study its impact on signals through the impact response of transmission channel.
At present, our company through a large number of experiments, choose different types of ink and viscosity, adjust the pressure of screen printing, basically solve the hole hole and uneven, has adopted this process for mass production.
The domestic leading automobile board represented by Shanghai Electric Company has actively participated in international cooperation and introduced advanced technology. The high-frequency PCB used for millimeter wave radar has been mass-produced.
PCB Assembly, PCB Manufacturing and prototyping The technology used in PCB production has been greatly modified in order to maintain quality and durability with zero defect mass production.
While raw material test methods often introduce uncertainties related to test fixtures or test devices, circuit test methods include uncertainties from test circuit design and fabrication techniques. Because the two methods are different, measurement resu
Analysis of the causes of holes (bubbles) in solder joints in PCBA patch processing: 1, the influence of flux activity, 2, related to the oxidation degree of PCB pad, 3, the influence of solvent boiling point, 4, related to the welding time, 5, the solder
Poor weldability of circuit board holes will produce virtual welding defects, affect the parameters of components in the circuit, lead to the instability of multilayer components and inner wire conduction, and cause the functional failure of the entire ci
With the expansion of 5G commercial pace, the upgrading of consumer electronic products and the emergence of new applications, the further growth of Internet traffic, and the increasing demand for switches and servers driven by the construction of data ce
With the expansion of 5G commercial pace, the upgrading of consumer electronic products and the emergence of new applications, the further growth of Internet traffic, and the increasing demand for switches and servers driven by the construction of data ce
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