Hd understand the basic architecture of tight HDI board PCB
With the introduction of surface mount technology, automatic detection technology of circuit board is applied, and the packaging density of circuit board increases rapidly.
With the introduction of surface mount technology, automatic detection technology of circuit board is applied, and the packaging density of circuit board increases rapidly.
The circuit board makes the circuit miniaturized and intuitive, which plays an important role in the mass production of fixed circuit and the optimization of electrical appliance layout.
In PCB, EMI can be produced for many reasons, such as: RF current, common mode level, ground loop, impedance mismatch, magnetic flux
as PCB substrate epoxy resin (see the column of PCB substrate resin chapter), PCB substrate reinforcement materials, copper foil and other manufacturing technologies have not realized commercial production.
Otherwise, you may be forced to make modifications and redesign your PCB stack structure.
Any circuit board material used in millimeter-wave circuits should have a low TCDk value to minimize the impact of Dk changes on circuit performance (such as phase shift).
these changes in Dk will introduce certain impedance errors when designing millimeter-wave transmission lines using computer simulation software.
to produce a conductive channel on the circuit board that allows the later process to complete the connection between the upper/lower or intermediate circuit layers
Connectivity through holes For multi-layer circuit boards to conduct connectivity tests, the purpose is to find out whether the PCB graphics have connectivity.
Some do not notice this phenomenon, directly adjust the sense resistance or working frequency to reach the required current, which may seriously affect the service life of LED.
These products and solutions can be applied to mobile devices such as smartphones, tablets and wearables, as well as high-speed data communication devices.
The layout of the basic structure such as PAD, design rule check (DRC), parameter extraction (EXT) and layout circuit control (LVS) associated with the design tool are the key to the successful production of the designed chip in the wafer factory. This is