Chip production process: 1, silicon purification to make wafers, 2, wafer coating, 3, wafer lithography development, etching, 4, mixed with impurities, 5, wafer testing, 6, chip packaging, 7, testing, packaging
Wiring is generally divided into three levels: one is the layout, which is the most basic requirements of PCB design, the second is to meet the electrical performance, which is the standard to measure whether the circuit board is qualified. Three is beaut
Whether in the manufacturing and assembly process or in actual use, PCB to have reliable performance, this is very important.
The high floor board uses high TG, high speed, high frequency, thick copper, thin dielectric layer and other special materials, which puts forward high requirements for the inner line fabrication and graphic size control.
PCB design must meet the requirements of SMT equipment, otherwise it will affect the production efficiency and quality, and may even be unable to complete automatic SMT by computer.
The key points to understand the patch factory: 1. Professional cooperation, 2. Quality management process, 3. The mental outlook of management and staff
Materials for PCBA electronic products patch processing: 1. Complete PCB board making file and board making requirements; 2. 2. Complete BOM, 3. PCBA assembly drawing, PS: report the cost of PCBA function test, and provide the method of PCBA function test
PCBA proofing operation process :1. Customers place orders; 2. Customers provide production materials; 3. Purchased raw materials, 4. Incoming material inspection, 5. PCBA production, 6. PCBA testing, 7. After packaging
In fact, printed PCB circuit boards used in electronic equipment are different, and printed PCB circuit boards are classified differently according to different specifications.
The automotive PCB market is benefiting from the increasing electronization of vehicles as consumers demand more functionality and safety.
Failure analysis is an important part in the reliability of SMT electronic assembly process. It is necessary to have certain testing and analysis equipment to carry out the failure analysis of electronic process.
How to do electromagnetic compatibility design :1. Suitable wire width,2. Key points of component wiring,3. Wiring rules for high frequency and high speed signals
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