PCB nickel plating
Organic pollution of gold cylinder using carbon core continuous filtration, and add appropriate amount of gold-plated additives.
Organic pollution of gold cylinder using carbon core continuous filtration, and add appropriate amount of gold-plated additives.
Communicate electronic devices. Military weapon system, as long as there is integrated circuit and other electronic devices, electrical interconnection between them to use PCB, circuit board.
the dielectric constant is small, can be used in high frequency. If applied to the electronic communication industry, it can greatly reduce the signal loss rate. The price of ordinary PCB board on the market will vary according to different materials.
At present, there are two kinds of metallization methods for LTCC subgrade plate: thick film sintering method and sputtering film plating thickening method.
Low temperature co-fired ceramics (LTCC) is a multi-layer ceramic manufacturing technology that integrates interconnection, componentless and encapsulation.
Although the miniaturization trend makes it more challenging, it is possible to use multiple connector groups on two PCB boards by using best design practices.
Chip-on-chip (WCSP) or core-sized ball grid arrays (DSBGA) use fine-pitch wire bonding and flip-chip interconnection, and are available in SiP, modular, stacked and recessed core-based formats.
The high-rise plate is thicker, heavier and larger than the conventional multilayer plate. The corresponding heat capacity is also larger. When welding, more heat is needed and the welding high temperature time is longer.
In order to achieve the smaller space, faster speed, higher performance of the goal, the printed circuit board "light, thin, short, small" requirements continue to improve, PCB board structure requirements continue to improve.
Many peers have completed the planning of electronic products often appear problems. Related to the lack of necessary elements in the planning of electrical principles, but more important is when all necessary elements are considered.
The manufacturing process of dry press PCB electronic ceramics mainly includes blank forming, blank sintering and finishing, forming circuit on the substrate.
These PCBS are widely used in mechanically sensitive devices because the flexibility allows the board to resist vibration. Flexible PCB is more durable than traditional PCB, but flexible PCB manufacturing process is sensitive and complex.