SMT patch processing basic introduction: high assembly density, small size of electronic products, light weight, high reliability, strong vibration resistance. Low defect rate of solder joint, good high-frequency characteristics, reduce electromagnetic an
In the main PCB circuit boards and components are not possible to increase the price, so the cost is reflected in the link of assembly. : 1, auxiliary materials: tin paste, tin strip, flux, UV glue, through the furnace fixture, 2, smt patch processing, 3,
Static electricity is the relatively static charge, is the excess or insufficient static charge on the surface of the object; Is a physical phenomenon in which the positive and negative charges on the surface of an object are separated.The basic physical
By shortening construction time and compressing work-in-process retention.Difficulty is the ladder of success, the success of the process is reasonable, reasonable, reasonable.
The fact that there are few restrictions on where components can be placed and no "infallible" rules doesn't mean you can do whatever you want.
Engineering software and online resources tend to be expensive, but can be very beneficial for professionals, students, and hobbyists.
When looking for faulty capacitors, it is important to check the capacitors close to the heat source, such as the capacitors near the heat sink and high-power components. The closer to the capacitors, the greater the possibility of damage.
In the future, the application of KPI will become more and more important and will become an objective basis for the improvement and evaluation of intelligent manufacturing related projects.
The size of electronic devices is also getting smaller, which requires that the heat dissipation device itself should have certain heat dissipation conditions, and the heat dissipation device itself should also have certain heat dissipation conditions.
The base material of printed circuit board is usually glass fiber reinforced phenolic resin or epoxy resin, and various components are welded on it. The composition is very complex, including a variety of metals, which has high resource recovery value.
With the gradual development of electronic products to fine and intelligent, more materials are applied in them. Understand the characteristics of various materials used in the product, and adopt more suitable laser processing technology and process.
Among many packaging methods, ceramic circuit boards have gradually become the ideal packaging substrates for new generation integrated circuits and power electronic modules.
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