Four characteristics of PCB gold sinking process: 1. Gold sinking plate bright color, good color, beautiful, enhance the appeal to customers. 2. The crystal structure formed by sinking gold is easier to weld and has better performance to ensure the qualit
The influence of human factors on manual welding of soldering iron is more. Machine welding, once the process parameters are adjusted, the production is very stable, but there are problems of welding temperature and welding time in manual welding.
According to the requirements and requirements of failure analysis, it is necessary to adopt various analysis techniques and methods to determine the location of failure, the degree of failure, the cause and mechanism of failure.
Basic principles of SMB design: layout, wiring, wire width, printed wire spacing, selection of components, selection of PCB substrate, PCB anti-electromagnetic interference, PCB heat dissipation, and arc Angle.
The reasons for the need for post-welding processing are as follows: 1, the components are not resistant to high temperature, 2, the components are too high, 3, there are a small number of plug-ins in the side of the wave crest, 4, the components plug-in
Application scope: SMT, LED, BGA, CSP flip chip testing, semiconductor, packaging components, lithium industry, electronic components, automotive parts, photovoltaic industry, aluminum die casting, molded plastics, ceramic products and other special indus
In the dispensing process, the technical parameters of the patch glue and the dispensing machine can be changed as follows: (1) the rheology of the patch glue. (2) The initial adhesive strength of the patch adhesive. (3) glue point contour. (4) glue point
A perfect PCB board not only needs to do the component selection and setting is reasonable, but also needs to have good signal conduction performance.
The simplest multilayer soft PCB is a three-layer soft PCB formed by two layers of copper shielding on both sides of a single-sided PCB. The most commonly used multilayer soft PCB structure is the four-layer structure.
Analysis of bad causes of PCBA patch processing plant: 1, PCBA air welding, 2, PCBA short circuit, 3, PCBA warping, 4, PCBA missing parts, 5, PCBA tin beads, 6, PCBA offset
In the PCB industry using laser marking two-dimensional code technology, can realize PCB production, process, quality traceability, and realize the automation, intelligent management requirements.
Prevention can be carried out in the following ways: 1, moisture-proof storage of components, 2, choose well-known brand solder paste, 3, adjust printing parameters, 4, adjust reflow temperature curve, 5, try to use reflow welding, reduce manual welding,
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