With the reduction of the aperture, the original debris that has no effect on the larger aperture, pcb board factory, such as brush debris, volcanic ash, once remaining in the hole, will make the chemical precipitation of copper, copper plating will lose
Even the well-written and actually implemented technical specifications for PCB laminates do not specify the test items that must be carried out to determine that PCB laminates are the cause of manufacturing process problems.
Poor insulation of copper wire will lead to arc between copper wire and copper wire. Too close between the copper trace and the path, it is easy to short-circuit risk; The lack of thickness of the circuit board can lead to bending and breaking.
After the circuit is completed, solder resistance ink is coated on the circuit as protection of the circuit. There are liquid photosensitive, heat curing and UV hardening.
Once a PCB laminate problem is encountered, it should be considered to add to the PCB laminate material specification.
In the era of HDI high-density connection technology, the line width and line distance will inevitably become smaller and denser, and thus a different type of PCB structure is derived.
Mobile terminal with HDI board is the main point of PCB growth. The mobile terminal represented by smart phone drives HDI board higher density and thinner. PCB all to high density fine line development, HDI board is particularly prominent.
Through the hole plug oil process is one of the hole treatment methods, the first is to opaque, above must have ink cover, plugging; The second is the hole can not appear yellow phenomenon, and do not touch tin.
Board bubbling is one of the most common quality defects in PCB production. Because of the complexity of PCB production process and process maintenance, especially in chemical wet treatment, it is difficult to prevent board bubbling defects.
The abnormal quality of PCB board will cause direct losses to customers and PCB manufacturers. The loss of copper wire is one of the abnormal quality phenomena, but this kind of abnormal will cause greater losses to PCB manufacturers.
The PCB industry has been shifting its focus to Asia, gradually forming a new pattern with Asia as the center and other regions as the auxiliary. The Asian continent has become the main production base of PCB and its high-end products HDI in the world.
For electronic equipment, a certain amount of heat will be generated when working. If the heat is not dissipated in time, the equipment will continue to heat up, and the devices will fail due to overheating.
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