Detailed back drilling process in PCB circuit board production
In China, the demand for backplanes mainly comes from the communications industry, which is now growing in the field of communications equipment manufacturing.
In China, the demand for backplanes mainly comes from the communications industry, which is now growing in the field of communications equipment manufacturing.
To evaluate the heat dissipation capacity of PCB, it is necessary to calculate the equivalent thermal conductivity (9EQ) of the insulating substrate for PCB, which is composed of various materials with different thermal conductivity.
The advantage of performing reception equalization in standalone devices is that it provides optimal wiring advantage and design flexibility.
The current approach is to increase the distance between the two signal layers and make the lines of the two layers as vertical as possible to avoid signal crosstalk between layers.
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This technology has become a necessary means of detection in fine wire production, and is being rapidly popularized, applied and developed.
the thermal performance index analysis software module added in some professional PCB design software can help designers optimize circuit design.
there are still some differences between high frequency products and high speed products in the demand for plate.
In order to eliminate electrostatic discharge (ESD) interference and damage to electronic equipment, it is necessary to take a variety of technical measures to prevent.
PCB board is printed with solder paste, installed with electronic components, and then fixed by reflow welding.
There are three main types of metal substrate: aluminum substrate, copper substrate, iron substrate. Iron substrate is rarely used in the market, here the focus of analysis is aluminum substrate, copper substrate.
Industrial circuit boards should pay attention to heat dissipation problems; The second is printed board copper foil line, poor quality circuit board power supply line copper foil is very thin, easy to burn due to the current.