Therefore, on SMT printed boards, through holes are used only to connect the wires on both sides of the board, the number of holes is much smaller, and the diameter of the holes is much smaller. In this way, the assembly density of the circuit board can b
The development trend of PCB manufacturing technology in the future is to high density, high precision, fine aperture, fine wire, small spacing, high reliability, multi-layer, high-speed transmission, light weight, thin shape.
Flexible Printed Circuit (PCB) can be designed with the general design of PCB software. Also use Gerber format for FPC manufacturers. Because the manufacturing process is different from ordinary PCBS, each manufacturer will have their own limits on minimu
Flexible Printed Circuit (PCB) can be designed with the general design of PCB software. Also use Gerber format for FPC manufacturers. Because the manufacturing process is different from ordinary PCBS, each manufacturer will have their own limits on minimu
At the same time, it must be easily removed by flux quickly in the subsequent welding high temperature for welding. OSP process is simple, low cost, widely used in PCB manufacturers.
The bubbling of the circuit board is actually the problem of poor binding force on the board, and by extension, the surface quality of the board, which contains two aspects.
PCB circuit board manufacturers to PCB circuit board related design parameters detailed.
High Tg material: the so-called Tg value, now electronic products require the circuit board to be resistant to high temperature, at a certain temperature, the circuit board can not burn, can be softened, the softening temperature is called glass conversio
Now the installation is mechanized, the hole position of the circuit board and the deformation error of the circuit and the design should be within the allowable range.
Experienced power developers know that EMI suppression in the PCB design process can save a lot of time for EMI suppression design in the final process to the greatest extent. This article will explain to you the specification steps in PCB EMI design, int
Wiring is the most important process in PCB design. This will directly affect the performance of PCB board. In the process of PCB design, wiring generally has such three levels of division: the first is the cloth, the most basic requirements of PCB design
Attention should be paid to the wiring of signal lines under magnetic beads, between pads and those that may come into contact with magnetic beads. Some magnetic beads conduct electricity quite well and may produce unexpected conductive paths.
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