which makes the direction of high frequency, high power and miniaturization. High signal power, high current and high voltage put forward higher requirements for PCB surface copper degree and hole copper thickness.
ad is a very important concept, PCB engineers must be familiar with it. although familiar, many engineers on the pad knowledge is only a little. The types and design standards of pad in PCB design will be introduced in detail below.
At this stage, we move from written blueprints to physical representations constructed using laminate or ceramic materials. Some of the more complex applications require flexible PCBS when particularly compact Spaces are required.
The main reason of electromagnetic interference caused by ground wire in PCB is the impedance of ground wire. When an electric current flows through a ground wire, a voltage is generated on the ground wire. This is ground noise. Driven by this voltage, a
Printed circuit board will appear in almost every kind of electronic equipment, is the basis of the entire electronic products.
The wiring design of electronic components has more and more influence on whether the test can be carried out well in the manufacture process of PCBA. Here are some important rules and practical tips.
With the success of high-speed PCB design, the contribution to EMI has been paid more and more attention. Almost 60% EMI problems can be controlled and solved by high-speed PCB. I have done EMI design for 4 years, and I have some ideas to communicate with
layout designers must ensure that their work is fully documented and that the final product is ready to be included in the main electronic system of their design.
Poor insulation of copper wire will lead to arc between copper wire and copper wire. Too close between the copper trace and the path, it is easy to short-circuit risk; The lack of thickness of the circuit board can lead to bending and breaking.
high speed circuit design technology has become the electronic system designers must take the design means. The controllability of the design process can only be achieved by using the design techniques of high speed circuit designers.
n electronic product that does not conform to EMC specifications is not an acceptable electronic design. In addition to meeting market functional requirements, design products must also adopt appropriate design techniques to prevent or relieve EMI effects
In practical EMI shielding, the electromagnetic shielding efficiency depends largely on the physical structure of the chassis, namely, the continuity of conduction. The seams and openings in the chassis are leakage sources of electromagnetic waves.
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