EMC specification for RF PCB design
In the actual design, the frequency, power rate and gain should be considered comprehensively to decide whether to add shielding plate.
In the actual design, the frequency, power rate and gain should be considered comprehensively to decide whether to add shielding plate.
No matter what work you are engaged in in the circuit board industry, if the circuit principle of electronic products is clear, you can improve the efficiency of functional testing and production efficiency of products. A trick takes you to understand the
In high speed PCB, RF energy is usually coupled between the power plane and the ground plane to become the edge flux leakage.
In the process of transmission, if the characteristic impedance of the transmission path changes, the signal will reflect at the node where the impedance is discontinuous.
Emc and associated EMI have historically required the eyes of system design engineers, but today board designs and component packages are shrinking and Oems are demanding faster systems.
The key of RF circuit PCB design is how to reduce circuit radiation and improve anti-interference ability, but in the actual layout and routing of some problems are in conflict with each other.
The comparison between design and wiring is a major error in the final stage of PCB design. So a number of things need to be checked again, such as device size, hole quality, pad size and review level.
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Layout is an important part of design. The result of layout will directly affect the effect of wiring, so it can be considered that a reasonable layout is the first step of successful PCB design.
The layout should meet the following requirements as far as possible: the overall connection should be as short as possible, and the key signal line should be the shortest; High voltage and high current signals are completely separated from low voltage, l
The size and type of embedded circuits vary by microprocessor, component, and operating system, but most importantly is the complexity of the software, whose code ranges from a few hundred bytes to several megabytes.
these devices must acquire higher clamp voltages and switching frequencies, with the accompanying heat dissipation capability. Here, we consider the influence of different cooling PCB pads on IGBT thermal performance under different working conditions.