What are the differences between PCB layers?
In the design of PCB, I found that many people do not understand the layers of PCB, each layer has the characteristics of each layer, function.
In the design of PCB, I found that many people do not understand the layers of PCB, each layer has the characteristics of each layer, function.
When looking for faulty capacitors, it is important to check the capacitors close to the heat source, such as the capacitors near the heat sink and high-power components. The closer to the capacitors, the greater the possibility of damage.
With the development of miniaturization of electronic products and high-density assembly of circuit board components, SMT production and testing have brought great challenges.
Through hole is one of the important components of multi-layer PCB. From the perspective of function, through hole can be divided into two categories: one is the electrical connection between each layer; The second is the device fixing or positioning.
On the automatic surface mounting line, if the PCB is not smooth, it will cause inaccurate positioning, components cannot be inserted or affixed to the holes of the board and the surface mounting pad, and even crash the automatic inserting machine.
PCB deformation causes can be divided into thermal stress and mechanical stress. The thermal stress is mainly produced in the process of pressing, and the mechanical stress is mainly produced in the process of stacking, handling and baking.
In any switching power supply design, the physical design of the PCB board is the last link. If the design method is not correct, the PCB may radiate excessive electromagnetic interference, causing the power supply to work unstable.
PCBA is one of the basic components of electronic components, PCB it through surface assembly technology (SMT), and the whole process of DIP plug-in insertion, known as PCBA process.
The basic process composition of SMT patch processing includes: screen printing (or dispensing), mounting (curing), reflow welding, cleaning, detection, repair screen printing
Several parts of the circuit board are mainly: 1. Bare copper plate: 2. Gold plate: 3. Spray tin circuit board: 4. OSP process board is also called organic welding film in SMT factory.
In the future, the application of KPI will become more and more important and will become an objective basis for the improvement and evaluation of intelligent manufacturing related projects.
From PCB design to the completion of welding of all components into a high quality circuit board, PCB design engineers and even the level of welding process, welding workers and many other links have strict control.